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Through-silicon via
Results: 53

#	Item
41	CMOSAIC RTD 2009 Intra chip stack fluidic cooling: the CMOSAIC demonstrator Add to Reading List Source URL: www.nano-tera.ch Language: English - Date: 2013-05-29 05:14:58 Integrated circuits Electronics manufacturing Electromagnetism Through-silicon via Flip chip Via Solder Three-dimensional integrated circuit Electronic engineering Electronics Semiconductor device fabrication
42	White Paper Test Automation of 3D Integrated Systems January 2012 Add to Reading List Source URL: www.synopsys.com Language: English - Date: 2014-11-07 12:41:47 Integrated circuits Semiconductor device fabrication Through-silicon via Software testing Electronic design Automatic test pattern generation Boundary scan Automatic test equipment Synopsys Electronic engineering Electronics Technology
43	Project ESiP ENIAC Joint Undertaking White Atrium Bldg., Avenue de la Toison d’Or 56-60, 1060 Brussels, Belgium Mail: TO[removed]Brussels, Tel: +[removed], Fax: +[removed]Email: [removed] Add to Reading List Source URL: www.eniac.eu Language: English - Date: 2013-11-28 09:49:31 Electronics Integrated circuits Semiconductors EV Group Reliability engineering Reliability Through-silicon via Network on Terminal Architecture System in package Semiconductor device fabrication Technology Electronic engineering
44	SPTS Catrene 3D presentation_Jan[removed]Compatibility Mode] Add to Reading List Source URL: www.catrene.org Language: English - Date: 2014-02-03 04:38:44 Technology Through-silicon via Three-dimensional integrated circuit Back end of line Microelectromechanical systems MPEG transport stream Copying Wafer Semiconductor device fabrication Electronics Electronic engineering
45	PDF Document Add to Reading List Source URL: msu.euramet.org Language: English - Date: 2014-06-13 12:55:32 Materials science Three-dimensional integrated circuit Through-silicon via Wafer Chemical-mechanical planarization Integrated circuit Microelectromechanical systems Metrology Semiconductor device fabrication Technology Microtechnology
46	j431 Index a acoustic microscopy 406, 407 – bonded wafer thickness, measuring 417 Add to Reading List Source URL: www.wiley-vch.de Language: English - Date: 2014-03-31 21:03:45 Technology Three-dimensional integrated circuit Wafer backgrinding Wafer dicing Wafer Through-silicon via Microelectromechanical systems SUSS MicroTec Chemical-mechanical planarization Semiconductor device fabrication Microtechnology Electronics
47	Author manuscript, published in "IP-Embedded System Conference and Exhibition (IP-SoC 2011), Grenoble : France (2011)" IP-SOC 2011 3D Architecture Implementation: A Survey M. H. Jabbar, D. Houzet Add to Reading List Source URL: hal.archives-ouvertes.fr Language: English - Date: 2013-09-09 05:31:32 Technology Semiconductor device fabrication Three-dimensional integrated circuit Very-large-scale integration Through-silicon via Network On Chip ATI Technologies AMD 10h System on a chip Integrated circuits Electronic engineering Electronics
48	Microsoft Word - Document1 Add to Reading List Source URL: www.imapsne.org Language: English - Date: 2014-06-04 09:00:45 Electronics Semiconductor device fabrication Packaging Textron Textron Systems System on a chip Through-silicon via Packaging and labeling Packaging engineering Technology Integrated circuits Electronic engineering
49	Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D Add to Reading List Source URL: www.ziptronix.com Language: English - Date: 2012-12-12 11:53:15 Electronics Integrated circuit Wafer Through-silicon via Silicon Three-dimensional integrated circuit Wafer backgrinding Semiconductor device fabrication Chemistry Microtechnology
50	HPCwire: Stacking Stairs Against the Memory Wall Add to Reading List Source URL: hybridmemorycube.org Language: English - Date: 2013-05-10 12:23:46 Technology Electronic engineering Through-silicon via Random-access memory Computer memory Electronics Dynamic random-access memory

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